Incredible,
Invisible
Innovation
μ-Material Machine™
Shin-Etsu Chemical has been focusing on combining material technology and equipment technology, including the development of high-speed mass transfer process of micro LED chips. µ-Material Machine Business Unit was established in May 2024 and proposes next-generation process by bringing Shin-Etsu Chemical’s technologies together.
We achieved high-speed high-precision mass transfer process of micro LED chips by combining excimer laser LLO (Laser Lift Off) technology with optimization of silicone properties (adhesion, hardness, etc.) and precision microfabrication technology.
The excimer laser technology which we have cultivated in micro LED process can be also used for solution of advanced IC substrate. We developed “Shin-Etsu Dual Damascene technology”, which forms via holes and wiring trenches by ablating insulation material of package substrate or redistribution layer (RDL) using excimer laser.
In the fields of sensors, optical devices and other electronic components, devices are becoming smaller and thinner, and the number of chips per single wafer is dramatically increasing. The handling of such micro devices is more and more difficult. In packaging process and CoW process, conventional equipment (one by one pick-up and place) is facing technology limit and cost issue due to slow process time. We developed higher throughput and lower cost process by ultra-high-speed mounting technology in combination of laser and material technologies.
Going beyond the framework of a material manufacturer, Shin-Etsu Chemical will act as a "One-Stop Solution Provider" and drive the development of next-generation technologies to contribute to the realization of an affluent society.
