Shin-Etsu Chemical exhibits JPCA show (Japan Electronics Packaging and Circuits Association).
【Summary】 Silicon Interposer which used for interconnection of chiplet in advanced IC package is facing issues such as enlargement of package size, lower yield, higher cost. Shin-Etsu Chemical offers excimer laser equipment and the process for manufacturing advanced IC package substrate and RDL.
| Exhibition in JPCA show 2025 | |
|---|---|
| DATE | June 4–6, 2025 |
| LOCATION | TOKYO BIGSIGHT (3-11-1 Ariake, Koto-ku, Tokyo, Japan) |
| BOOTH | 5C-08 (Zone: PWB Tech) |
| NOTE | Pre-Registration required from the following website https://www.jpcashow.com/show2025/index.html |
